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8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

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8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

Brand Name : YUSHUNLI

Model Number : ADS2000

Certification : CE

Place of Origin : China Dongguan

MOQ : 1set

Price : USD1000~10000

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 60Sets/Month

Delivery Time : 5-7work days

Packaging Details : plywooden case

Dimensions of processing : Φ300mm

power supply : 3P , 220 (50 ~ 60 Hz)V

machine power : 8KW

Power air pressure : 0.6 ~ 0.68MPa

Air consumption : 250L/min

Cutting water consumption : 6.5L/min

cooling water consumption : 2.5L/min

（W×D×H） physical dimension : 1262×1704×2023mm

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Automatic Semiconductor Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic
 
Features of products
 
• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese,English, Korean, etc.
• Feeding, position align, cutting, cleaning / drying and unloading all automatically completed.
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
• CCD automatic align.
• Real-time monitoring system of the pressure, water pressure, current, etc., to avoid damage to the air spindle.
• Dicing spindle: 2.4 kw × 2set (Max: 60,000 rpm)
•  Repeat positioning accuracy : 0.001mm
• Cutting speed: 0.05 ~ 400 mm/sec
• Each magazine can be stored 20 ~ 30 layers of frame.
• Standard collocation of using blade size: 2 Inch(Max:3 Inch)
 
Specs:
x-axis
Working stroke
500mm
 
cutting speed
0.05 ~ 400mm/sec
 
resolution
 0.0001mm
y-axis
Working stroke
650mm
 
resolution
0.0001mm
 
Repeat positioning accuracy
0.001 / 310mm
z-axis
Working stroke
60 (2 Inch blades)mm
 
resolution
0.0001m
Θ-axis
Angle of rotation
 360deg

 

Dimensions of processing
Φ300mm
Dimensions of working platform
Φ350
power
2.4×2 set KW
speed
5,000 ~ 60,000 rpm
power supply
3P , 220 (50 ~ 60 Hz) V
machine power
 8KW
Power air pressure
0.6 ~ 0.68MPa
Air consumption
 250L/min
Cutting water consumption
 6.5L/min
cooling water consumption
 2.5L/min
(W×D×H) physical dimension
1262×1704×2023
machine net weight
 1000KG

 

8KW CCD Automatic Align Semiconductor Wafer Cutting Machine
 
Process description
 
1.Mechanism remove it from magazine,and send it to the temporary table.
2.Unloading robot will move the dicing material to chunk. for dicing process.
3.Feeding robot move the dicing material to the cleaning platform for cleaning and drying process.
4.Unloading robot send material having been cleaned and dried to the temporary table.
5.Robot send the dicing material to the magazine .
 
8KW CCD Automatic Align Semiconductor Wafer Cutting Machine
 
Optional equipment
 
1,Function of blade damage detection;
2,Automatic setting function;
3,Dicing visual function;
4, Using dicing blade with 3 Inch.
 
Case Sharing

 

8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

8KW CCD Automatic Align Semiconductor Wafer Cutting Machine


Product Tags:

8KW Wafer Cutting Machine

      

CCD Automatic Align Wafer Cutting Machine

      

400mm/s PCB Cutting Machine

      
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